1. Advances in electronic circuit packaging; proceedings
Author: Edited by Lawrence L. Rosine
Library: Library of College of Science University of Tehran (Tehran)
Subject: Congresses ، Electronic packaging
Classification :
TK
7870
.
I574
1962
2. Advances in electronic circuit packaging; proceedings
Author: Edited by Lawrence L. Rosine
Library: Library of College of Science University of Tehran (Tehran)
Subject: Congresses ، Electronic packaging
Classification :
TK
7870
.
I574
1964
3. Advances in electronic circuit packaging; proceedings
Author: Edited by Gerald A. Walker
Library: Library of College of Science University of Tehran (Tehran)
Subject: Congresses ، Electronic packaging
Classification :
TK
7870
.
I574
1960
4. Advances in electronic circuit packaging : proceedings of the fifth International Electronic Circuit Packaging Symposium, held at Boulder, Colorado, August 19-21, 1964
Author: Edited by Lawrence L. Rosine
Library: Central Library of Amirkabir University of Technology (Tehran)
Subject: Electronic packaging Congresses
Classification :
TK
7870
.
I57
1960
5. Advances in electronic packaging, 1995 : proceedings of the International Intersociety Electronic Packaging Conference - INTERpack 95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Luhaina, Maui, Hawaii
Author: Sponsored by the Electrical and Electronic packaging Division, ASME, The Japan Society of Mechanical Engineers; edited by Tai Ran Hsu, Avram Bar-Cohen, Wataru Nakayama
Library: Central Library of Amirkabir University of Technology (Tehran)
Subject: Electronic packaging - Congresses
Classification :
TK
7870
.
15
.
I57
1995
6. Application of fracture mechanics in electronic packaging and materials : presented at the International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, Claifornia
Author: sponsored by the electrical and Electronic Packaging Division, ASME, The Materials Division, ASME ; edited by Tien Y. Wu ... ]et al.[
Library: Central Library of Amirkabir University of Technology (Tehran)
Subject: Electronic packaging - Materials - Congresses , Materials - Electric properties - Congresses
Classification :
TK
7870
.
15
.
A85
1995
7. Applications of experimental mechanics to electronic packaging -1997- : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
Author: sponsored by the Electrical and Electrnic Packaging Division, ASME, the Applied Mechanics Division, ASME; edited by J.C. Suhling, K.M. liechti, S. Liu
Library: Central Library of Amirkabir University of Technology (Tehran)
Subject: Electronic packaging - Congresses , Mechanics, Applied - Congresses
Classification :
TK
7870
.
15
.
A643
1997
8. CAE/CAD and thermal management issues in electronic systems
Author: / Sponsord by the electrical and electronic packaging division, ASME, edited by Derje Agonafer [et. al.]
Library: Library of Campus2 Colleges of Engineering of Tehran University (Tehran)
Subject: Electronic apparatus and appliances - Temmpreture control - Congresses,Electronic packaging - Design - Data processing - Congresses,Heat-Tranmission--Data processing - Congresses,Heat sinks (Electronics) - Congresses,Computer - aided engineering - Congresses
Classification :
TK
7870
.
25
.
C34
1997
9. CAE/CAD and thermal management issues in electronic systems
Author: / Sponsord by the electrical and electronic packaging division, ASME, edited by Derje Agonafer [et. al.]
Library: Tehran University, technical faculty libraries 1 (Tehran)
Subject: Electronic apparatus and appliances - Temmpreture control - Congresses,Electronic packaging - Design - Data processing - Congresses,Heat-Tranmission--Data processing - Congresses,Heat sinks (Electronics) - Congresses,Computer - aided engineering - Congresses
Classification :
TK
7870
.
25
.
C34
1997
10. CAE/CAD application to electronic packaging: presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994
Author:
Library: Central Library of Sharif University of Technology (Tehran)
Subject: Congresses ، Heat sinks )Electronics(,Congresses ، Electronic packaging,Congresses ، Heat sinks )Electronics(,Congresses ، Electronic packaging
Classification :
TK
7870
.
15
.
C33
1994
11. Components, packaging and manufacturing technology :
Author: edited by Yanwen Wu.
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Electronic apparatus and appliances, Congresses.,Electronic packaging, Congresses.,Manufacturing processes, Congresses.,Microelectronic packaging, Congresses.
12. Electrical performance of electronic packaging
Author:
Library: Central Library and Document Center of Shahid Madani University of Azarbayjan (East Azarbaijan)
Subject: Electronic packaging congresses,Materials - Electronic properties congresses
Classification :
TK
,
7870
.
15
,.
E383
13. Electronic packaging: materials and processes: Proceedings of ASM'S 2nd Electronic Packaging Materials and Processes Conference Bloomington, Minnesota, 29-31 October 1985: also includes selected papers from the 1st Electronic Packaging Conference; St. Paul, Minnesota, 21-23 August 1984
Author: edited by J.A. Sartell; Sponsored by ASM's Electronic Materials and Processing Division
Library: Central Library and Information Center of Ferdowsi University of Mashhad (Khorasan Razavi)
Subject: Electronic packaging - Congresses
Classification :
TK
7870
.
E5432
1985
14. IWIPP 2000 International Workshop on Integrated Power Packaging, July 14-15, 2000, Westin Hotel, Waltham, MA, USA
Author:
Library: Central Library and Information Center of Ferdowsi University of Mashhad (Khorasan Razavi)
Subject: Congresses ، Electronic packaging,Congresses ، Power electronics
Classification :
TK
7870
.
15
.
I44
2000
15. MCM C/Mixed Technologies and Thick Film Sensors :
Author: edited by W. Kinzy Jones, Karel Kurzweil, Gábor Harsányi, Sylvia Mergui.
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Electronic packaging -- Congresses.,Multichip modules (Microelectronics) -- Congresses.,Thick-film circuits -- Congresses.
Classification :
TK7870
.
15
E358
1995
16. Mechanics and materials for electronic packaging :
Author: co-sponsored by the Applied Mechanics Division, ASME ... [et al.].
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Electronic packaging-- Congresses.
17. Microscale heat transfer
Author: / edited by S. Kakac ... [et al.]
Library: Central Library and Information Center of the University of Mohaghegh Ardabili (Ardabil)
Subject: Heat- Transmission Congresses,Electronic packaging Congresses,Microscale heat transfer
Classification :
QC320
.
M54
2005
18. Microscale heat transfer
Author: / edited by S. Kakac ... [et al.]
Library: Central Library, Center of Documentation and Supply of Scientific Resources (East Azarbaijan)
Subject: Heat, Transmission, Congresses,Electronic packaging, Congresses
19. Microscale heat transfer
Author: / edited by S. Kakac ... [et al.]
Library: Central Library and Information Center of the University of Mohaghegh Ardabili (Ardabil)
Subject: Heat- Transmission Congresses,Electronic packaging Congresses,Microscale heat transfer
Classification :
QC320
.
M54
2005
20. Microscale heat transfer
Author: / edited by S. Kaka?c ... [et al.]
Library: Central Library and Document Center of Shahid Chamran University (Khuzestan)
Subject: Heat--Transmission--Congresses,Electronic packaging--Congresses
Classification :
QC
,
320
,.
M54
,
2005
